Our company - EP Electronic Print GmbH München

We…

design and project
design, develop and construct
milling, bolting, grinding and deburring
powder coating, anodizing and chromating
cut, laser
manufacture and assemble

assemble (THT & SMD)
dispense and dispose
assemble and complete (final assembly)
laminating, gluing and printing
are specialists in optical bonding and optical bonding
check our products 100% (functional and optical check)
EP chairs the Quality Assurance Working Committee (AAQS)

Convince yourself of our tailor-made products.

Our fields of application

For 30 years, our company has been developing and manufacturing individual input systems based on a wide variety of technologies. The high level of vertical integration allows us to implement customer-specific projects competently and quickly. At the same time, high quality and delivery reliability can be guaranteed in series production.

Our core competence lies in the area of medium quantities, so that we are mainly represented in the following industries:

Industrial and mechanical engineering
Automation technology
Medical technology
Analysis and measuring equipment
Building technology
Renewable energy

Our history

Since 1988 our company has been manufacturing input systems based on a wide variety of technologies at the Munich location. The areas of development, administration and production are united here under one roof.

2020 became a member of the VDMA
2019 Transparent conductive films based on carbon nanotube
2018 First series part production using a 3D printer
2016 Consolidation of the production areas / clean room class 6
2013 Capacitive input systems with optical bonding
2012 Chair of the Quality Assurance Working Committee (AAQS) at FT
2011 Another expansion of the production area by 1200 square meters
2008 Expansion of the production area by 1360 square meters
2006 Full-surface lamination in the clean room (ISO 14644-1 class 7)
2000 Joined the Input systems specialist group (FT)
1996 Certification according to DIN ISO 9001 expansion EP to 1300 sqm
1995 Metal processing for carrier and front panels
1994 Assembly of membrane keyboards and printed circuit boards
1989 First membrane keyboard
1988 First front membrane